-
2020`s
- 2023
-
03Participation in the 2023 Gas AMI Project
03Progress of the 2023 KEPCO 5-2nd AMI Project
- 2022
-
12The 2022 KEPCO 5-2 Phase AMI Project Contract Award
08Launch of Dual-Purpose Arc Fault Circuit Interrupter
- 2021
-
11World's First Arc Detection Chip Released
-
2010`s
- 2019
-
09 KEPCO AE-type PLC modem supply contract
07 Supplied Wi_Fi chips to Chinese large home appliance company Midea
01 Contracted with KT to supply LTE modem for trunk network for AMI business
01 KEPCO AMI 4th project resumed
- 2018
-
08 Signed an annual supply contract for Ea-type PLC modem for KEPCO
- 2017
-
12 Signed a contract for development and supply of Wi-Fi module for mobile receipt printer with SEIKO Instrument under SEIKO, Japan
12 Signed a contract to supply the new Wi-Fi'WF6000' chip with a first-class partner that supplies electronic parts to a Chinese white home appliance company
11 Completed the development of ANC (Active Noise Cancellation) chip prototype and signed a supply contract with a Chinese earphone and headset manufacturer
10World's first PLC wired communication + Wi-SUN wireless communication hybrid modem and DCU development completed
09 Completed supply of various wireless sensors and PLC modems for KEPCO AMI convergence platform pilot project
08 Signed an exclusive supply contract for AMI solutions for KT Giga Energy Manager business
- 2016
-
12Completed supply of PLC modem and DCU for KEPCO AMI 2nd project
10Selected as a promising small business in Gyeonggi-do
10KEPCO AMI 2nd project PLC modem 3 types
09 KEPCO AMI 2nd project DCU (data concentrator) and bridge order
06Completed development of ultra-small HS-PLC chipset for electric vehicle charging and discharging
03 Received an order for LTE high pressure meter reading modem for KT
- 2015
-
09Started supplying PLC-based lighting control modem and lighting controller (Korea Expressway Corporation)
06 Started supplying PLC modem (Korea Electric Power Corporation)
05Received the “Iron Tower Industry Medal” on the day of invention (Patent Office)
03Mobile carrier smart home service interlocking protocol development
- 2014
-
12Started to supply Wi-Fi Solution to IoT Device
10Released the Wi-Fi module (WFM50-SFC201)
07Selected as an excellent company for job invention (Invention Promotion Association)
03 Started mass production and supply of Wi-Fi products to Japanese customers (WFM50-SH201)
02PLC SoC development completed (P5000)
- 2013
-
12 Wi-Fi SoC development completed (WF5000)
12 Passed international standard (ISO/IEC12139-1) test for power line communication (PLC)
10 Head office relocated (Pangyo)
06 Merged with Caironet Co., Ltd.
- 2012
-
06 Completion of development of micro T-DMB SoC (T3A00)
01 Investment in Glovein Co., Ltd. (Digital Radio SoC)
- 2011
-
01 Selected as a participating company for the'Core System Semiconductor for IT Convergence Devices' for future industry leading technology development (Ministry of Knowledge Economy)
- 2010
-
12Equity investment in Caironet (Wi-MAX SoC)
-
2000`s
- 2009
-
12 ISDB-T 1-seg SoC development completed
10 Listed on KOSDAQ
- 2007
-
12 ISO 9001 and ISO 14001 certification completed (Quality/Environment Management Certification)
06 Completed development of T-DMB SoC (T3300)
- 2006
-
03 T-DMB Low IF RFT400 (Dual Band) development completed
- 2005
-
09 Selected as a specialized parts and materials company (Ministry of Commerce, Industry and Energy)
- 2004
-
08Security IC development completed
- 2001
-
05 Head office relocation (Songpa)
- 2000
-
04 Selected as a promising small and medium business (Small and Medium Business Administration)
-
1990`s
- 1998
-
08 Venture business certification (Korea Institute of Industrial Technology Evaluation and Management)
08 Designated as LG Semiconductor Design House
- 1997
-
03 Established company-affiliated research institute (Korea Industrial Technology Association)
- 1996
-
11 Established I&C Technology Inc.